Unlock Next‑Gen Edge Intelligence with PHYTEC’s phyCORE‑i.MX 8M Plus SOM
In a world accelerating toward intelligent automation, edge analytics, and real‑time industrial response, hardware must do more — faster…
Unlock Next‑Gen Edge Intelligence with PHYTEC’s phyCORE‑i.MX 8M Plus SOM
In a world accelerating toward intelligent automation, edge analytics, and real‑time industrial response, hardware must do more — faster, smarter, and securely. PHYTEC’s phyCORE‑i.MX 8M Plus System‑on‑Module rises to this challenge, redefining what’s possible at the edge.
Built on the powerful NXP i.MX 8M Plus SoC, this **System On Module** integrates a robust ARM architecture, on‑chip AI acceleration, advanced multimedia interfaces, and industrial‑grade connectivity — all within an ultra‑compact 40 mm × 37 mm footprint. It’s engineered to help developers bring cutting-edge embedded products to life quickly, reliably, and cost‑efficiently.

Why the phyCORE‑i.MX 8M Plus Is a Game-Changer
**PHYTEC** didn’t just build another SoM — they built a scalable, intelligent processing platform optimized for AI, vision, Industry 4.0, and IoT edge computing applications.
- AI at the Edge
Equipped with a Neural Processing Unit (NPU) delivering up to 2.3 TOPS, the System On Module enables on-device machine learning with minimal CPU load. Ideal for real‑time decision-making, computer vision, predictive maintenance, and more.
- Advanced Multimedia & Vision Processing
The module includes:
- Dual MIPI‑CSI camera interfaces
- On‑chip Image Signal Processor (ISP) supporting up to 12MP/375MP/s
- Display options including HDMI, LVDS, and MIPI‑DSI
- Industrial‑Grade Connectivity
With dual Gigabit Ethernet (TSN‑capable), USB 3.0, PCIe, CAN FD, and extensive I/O options, the SOM meets the demands of modern industrial systems — precise timing, secure communications, and robust integration.
- Designed for Low Power, High Reliability
Using NXP’s 14LPC FinFET technology, LPDDR4 memory, and a sophisticated PMIC, the SOM excels in thermally constrained and battery‑sensitive environments.
- Flexible Prototyping & Cost‑Optimized Production
Choose between:
- Connectorized variant for rapid prototyping
- Solder‑down version for mass‑production cost reduction
Top Use Cases Powered by phyCORE‑i.MX 8M Plus
Whether you’re building compact devices or industrial-grade automation, the module’s versatility shines:
✔ Smart Home / Smart City
✔ Industry 4.0 & Robotics
✔ Edge Computing / IIoT Gateways
✔ Multimedia & Imaging Systems
Why Engineers Choose PHYTEC SOMs
Developers prefer **PHYTEC** modules because they offer:
- Industrial reliability
- Long-term availability
- Custom hardware support
- Optimized BSP software
- Fast product development cycles
The phyCORE-i.MX 8M Plus continues this tradition by delivering powerful Edge AI capabilities in a compact and scalable form factor.
Get Ready for Embedded World 2026 — March 10–12
PHYTEC invites you to experience the future of Edge AI, Custom BSPs, and Industrial Embedded Innovation — live!
Live Demonstrations Include
- Driver Monitoring System (DMS) — detects drowsiness, distraction, phone usage, and even smoking
- Drone‑Based Parking (ROS 2) — vehicle detection, OCR, brand ID & occupancy analytics
- Celebrity Face Match — ultra‑fast identity matching using INT8 ResNet50
- Industrial Digital Twin — Wi‑SUN mesh‑powered motor monitoring with secure MQTT
- Scalable & Secure Wi‑SUN Mesh Network
Custom BSP Highlights
- Zephyr BSP — sensor nodes, OTA, networking & more
- Embedded Linux (Yocto) — NPU delegate, video pipeline, secure OTA updates
PHYTEC at Embedded World 2026
Visit us at Booth: 3‑641
Event Date: 10–12 March 2026
Location: Nuremberg, Germany
Book Your Slot For
- Private demo walkthroughs
- Technical consultations
- Business & partnership discussions
- Starter kits & early BSP release access
👉 Book Your Appointment Now : Click Here
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