Foxconn (Hon Hai) at Computex 2026

At Computex 2026, Foxconn (Hon Hai) showcased its advanced infrastructure capabilities designed for the next generation of AI computing. The exhibit highlighted a comprehensive suite of hardware solutions, notably focusing on liquid cooling technologies (including quick disconnects and various manifolds) and power distribution components like AC whips, specifically engineered to support Nvidia’s Vera Rubin NVL72 and NVL8 rack architectures. Additionally, the display featured high-performance networking and computing hardware, such as the Nvidia Spectrum-X SN6600 Ethernet switch, GB2281A AI accelerators (featuring AMD MI355), and advancements in silicon photonics and optical transceivers.

Silicon Photonics:

Optical Tranceiver

Live demo

CPO ELSFP

Liquid Cooling Quick Disconnect

AC Whip

Nvidia MGX Components for Vera Rubin NVL72

Liquid Cooling Switch

Nvidia Vera Rubin NVL72 Rack Manifold

NVL8 Coldplate for CPU & DIMM, Switch Manifold, Coldplate for E1.S

NVL8 Manifold for QM4, Coldplate for Connext-X9, Cold plate for OSFP

NVL72 Inner Manifold

GB2281A (AI Accelerator with AMD MI355)

Nvidia Spectrum-X SN6600 Ethernet Switch

XPO & CPC — ChipLink 448G

Nvidia HGX Rubin NVL8 GPU Tray

Nvidia HGX Vera CPU

Higer resolution full video:

[embed]