DSN FR Frederick T. Chen Easing of Multipatterning with Gridded Cuts and Vias Even with the emergence of EUV lithography, multi-patterning has remained a necessity going into the 3nm and 2nm nodes [1,2]. In…
LIF FR Frederick T. Chen Self-Aligned Block Redistribution and Expansion for Improving Multipatterning Productivity There has been much interest in Huawei’s and SMIC’s plans for 5nm production in the near future. Since there is no use of EUV in China…
